MPXH6101A
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MPXH6101A 1/2009
Integrated Silicon Pressure Sensor Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated Calibrated
Freescale MPXH6101A series Manifold Absolute Pressure (MAP) sensor engine control designed sense absolute pressure within intake manifold. This measurement used compute amount fuel required each cylinder. small form factor high reliability on-chip integration makes Freescale sensor logical economical choice automotive system designers. MPXH6101A series piezoresistive transducer state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, bipolar semiconductor processing provide accurate, high level analog output signal that proportional applied pressure.
MPXH6101A Series
(2.18 15.2 psi) Output
Application Examples
Manifold Sensing Automotive Systems Ideally Suited Microprocessor Microcontroller-Based Systems Also Ideal Non-Automotive Applications
Features
1.72% Maximum Error Over 85°C Specifically Designed Intake Manifold Absolute Pressure Sensing Engine Control Systems Temperature Compensated Over -40°C +125°C Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Device Name Package Options Case Ports None Pressure Type Single Dual Gauge Differential Absolute Option Surface ThroughMount Hole Device Marking MPXH6101A MPXH6101A MPXH6101A MPXH6101A
Super Small Outline Package (MPXH6101A Series) MPXH6101A6U Rails 1317 MPXH6101A6T1 MPXH6101AC6U MPXH6101AC6T1 Tape Reel Rails Tape Reel 1317 1317A 1317A
SUPER SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXH6101A6U/6T1 CASE 1317-04
MPXH6115AC6U/C6T1 CASE 1317A-03
Freescale Semiconductor, Inc., 2006, 2008, 2009. rights reserved.
Operating Characteristics
Table Operating Characteristics Vdc, 25°C unless otherwise noted, Decoupling circuit shown Figure required meet electrical specifications.)
Characteristic Pressure Range
Symbol 85°C) 85°C) 85°C) 85°C) Voff VFSO VFSS
4.75 0.117 4.933
0.222 5.013 ±0.5
0.327 5.092 ±1.72
Unit mAdc %VFSS mV/kPa mAdc %VFSS
Supply Voltage(2) Supply Current Minimum Pressure Offset Volts(3) Full Scale Output Volts Full Scale Span Volts Accuracy
Sensitivity Response Time
Output Source Current Full Scale Output Warm-Up Time Offset Stability
(kiloPascal) equals 0.145 psi. Device ratiometric within this specified excitation range. Offset (Voff) defined output voltage minimum rated pressure. Full Scale Output (VFSO) defined output voltage maximum full rated pressure. Full Scale Span (VFSS) defined algebraic difference between output voltage full rated pressure output voltage minimum rated pressure. Accuracy (error budget) consists following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from straight line relationship with pressure over specified pressure range. Output deviation temperature within operating temperature range, after temperature cycled from minimum maximum operating temperature points, with zero differential pressure applied. Output deviation pressure within specified range, when this pressure cycled from minimum maximum rated pressure, 25°C. Output deviation over temperature range 85°C, relative 25°C. Output deviation with minimum rated pressure applied, over temperature range 85°C, relative 25°C. variation from nominal values, Offset Full Scale Span, percent VFSS, 25°C.
Response Time defined time incremental change output from final value when subjected specified step change pressure. Warm-up Time defined time required product meet specified output voltage after Pressure been stabilized. Offset Stability product's output deviation when subjected 1000 hours Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6101A Sensors
Maximum Ratings
Table Maximum Ratings(1)
Rating Maximum Pressure Storage Temperature Operating Temperature Symbol PMAX TSTG Value +125 +125 Unit
Exposure beyond specified limits cause permanent damage degradation device.
Figure shows block diagram internal circuitry integrated pressure sensor chip.
Sensing Element
Thin Film Temperature Compensation Gain Stage
Gain Stage Ground Reference Shift Circuitry
Vout
Pins CONNECTS super small outline package devices.
Figure Fully Integrated Pressure Sensor Schematic
MPXH6101A Sensors Freescale Semiconductor
On-Chip Temperature Compensation Calibration
Figure illustrates absolute sensing chip super small outline package (Case 1317). Figure shows sensor output signal relative pressure input. Typical, minimum, maximum output curves shown operation over temperature range 85°C. output will saturate outside specified pressure range. fluorosilicone isolates surface wire bonds from environment, while allowing pressure signal transmitted sensor diaphragm. MPXH6101A series pressure sensor operating characteristics, internal reliability qualification tests based pressure media. Media, other than air, have adverse effects sensor performance long-term reliability. Contact factory information regarding media compatibility your application. Figure shows recommended decoupling circuit interfacing output integrated sensor input microprocessor microcontroller. Proper decoupling power supply recommended.
Wire Bond Lead Frame Thermoplastic Case
Fluoro Silicone Coat
Stainless Steel
Absolute Element Sealed Vacuum Reference
Bond
Figure Cross Sectional Diagram SSOP (not scale)
Output (Volts)
MPXH6101A Vout
Transfer Function: Vout (0.01059*P-0.10941) Error Temperature 85°C MPXH6101A
Figure Recommended Power Supply Decoupling Output Filtering
MPXH6101A Sensors
Pressure (ref: sealed vacuum)
Figure Output versus Absolute
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates sides pressure sensor Pressure (P1) side Vacuum (P2) side. Pressure (P1) side side containing fluorosilicone which protects from harsh media. Freescale pressure sensor designed operate with positive differential pressure applied, Pressure (P1) side identified using following table:
Part Number MPXH6101A6U/T1 MPXH6101AC6U/T1 Case Type 1317 1317A Pressure (P1) Side Identifier Stainless Steel Side with Port Attached
INFORMATION USING SMALL OUTLINE PACKAGES
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS Surface mount board layout critical portion total footprint, packages will self align when subjected design. footprint surface mount packages must solder reflow process. always recommended design correct size ensure proper solder connection interface boards with solder mask layer avoid bridging between board package. With correct shorting between solder pads.
0.050 1.27 0.150 3.81
0.387 9.83
0.027 0.69 0.053 1.35 inch
Figure SSOP Footprint (Case 1317)
MPXH6101A Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE SUPER SMALL OUTLINE PACKAGE
MPXH6101A Sensors
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE SUPER SMALL OUTLINE PACKAGE
MPXH6101A Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE SUPER SMALL OUTLINE PACKAGE
MPXH6101A Sensors
PACKAGE DIMENSIONS
CASE 1317A-04 ISSUE SUPER SMALL OUTLINE PACKAGE
MPXH6101A Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1317A-04 ISSUE SUPER SMALL OUTLINE PACKAGE
MPXH6101A Sensors
Reach
Home Page: www.freescale.com Support: USA/Europe Locations Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 +1-480-768-2130 www.freescale.com/support Europe, Middle East, Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 81829 Muenchen, Germany 1296 (English) 52200080 (English) 92103 (German) (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building Jianguo Road Chaoyang District Beijing 100022 China 5879 8000 support.asia@freescale.com Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 5405 Denver, Colorado 80217 1-800-441-2447 +1-303-675-2140 Fax: +1-303-675-2150
Information this document provided solely enable system software implementers Freescale Semiconductor products. There express implied copyright licenses granted hereunder design fabricate integrated circuits integrated circuits based information this document. Freescale Semiconductor reserves right make changes without further notice products herein. Freescale Semiconductor makes warranty, representation guarantee regarding suitability products particular purpose, does Freescale Semiconductor assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters that provided Freescale Semiconductor data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals", must validated each customer application customer's technical experts. Freescale Semiconductor does convey license under patent rights rights others. Freescale Semiconductor products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Freescale Semiconductor product could create situation where personal injury death occur. Should Buyer purchase Freescale Semiconductor products such unintended unauthorized application, Buyer shall indemnify hold Freescale Semiconductor officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Freescale Semiconductor negligent regarding design manufacture part. Freescaleand Freescale logo trademarks Freescale Semiconductor, Inc. other product service names property their respective owners. Freescale Semiconductor, Inc. 2009. rights reserved.
MPXH6101A Rev. 1/2009
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